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 HIP1031
December 1997
Half Amp High Side Driver with Overload Protection
Description
The HIP1031 is a High Side Driver Power Integrated Circuit designed to switch power supply voltage to an output load. It is the equivalent of a PNP pass transistor operated as a protected high side current switch in the saturated ON state with low forward voltage drop at the maximum rated current. It has low output leakage and low idle current in the OFF state. The Functional Block Diagram for the HIP1031 shows the protection control circuit functions of over-current, overvoltage and over-temperature. A small metal resistor senses overcurrent in the power supply path of the pass transistor and load. Overvoltage detection and shutdown of the output driver occurs when a comparator determines that the supply voltage has exceeded a comparator reference level. Overtemperature is sensed from a VBE differential sense element that is thermally close to the output drive transistor. In addition to the input detected overvoltage protection, negative peak voltage of an inductive load is clamped with an internal zener diode. An internal bandgap supply voltage source provides a stable voltage reference over the chip operating temperature range, providing bias and reference control for the protection circuits. The HIP1031 is particularly well suited for driving lamps, relays, and solenoids in automotive and industrial control applications where voltage and current overload protection at high temperatures is required. The HIP1031 is supplied in a 5 lead TS-001AA Power SIP package.
Features
* Over Operating Range. . . . . . . . . . . . . . -40oC to 125oC - VSAT at 0.6A . . . . . . . . . . . . . . . . . . . . . . . . . 1.0V Max - Power Supply Range . . . . . . . . . . . . . . . . 4.5V to 25V * Over-Voltage Shutdown Protected * Negative Output Voltage Clamp * Over-Current Limiting * Thermal Limiting Protection * Load Dump . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60VPEAK * Reverse Battery Protection . . . . . . . . . . . . . . . . .To -16V * CMOS/TTL Logic Level Control Input
Applications
* Motor Driver/Controller * Driver for Solenoids, Relays & Lamps * MOSFET and IGBT Driver
*
Driver for Temperature Controller
Ordering Information
PART NUMBER HIP1031AS TEMP. RANGE (oC) -40 to 125 PACKAGE 5 Ld TS-001AA SIP PKG. NO. Z5.067C
Pinout
HIP1031 (SIP) TOP VIEW
5 VIN (CONTROL) 4 GND 3 TAB GND 2 VOUT (LOAD) 1 VCC (SUPPLY)
Functional Block Diagram
VCC 1 VBATT SUPPLY
RS NEG. CLAMP ZENER
VOUT 2 LOAD
OVERVOLTAGE SHUTDOWN
CURRENT LIMIT
THERMAL LIMIT
CONTROL CIRCUIT
VIN 5 CONTROL 3 TAB 4 HIP1031
GND
GND
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999
File Number
3596.6
1
HIP1031
Absolute Maximum Ratings
Supply Voltage, VCC. . . . . . . . . . . See O.V. Shutdown Limit, VOVSD Input Voltage, VIN (Note 1) . . . . . . . . . . . . . . . . . . . . . . -0.8V to +7V Load Current, IOUT . . . . . . . . . . . . . . . . . . . . . . . Internally Limiting Load Dump (Survival) . . . . . . . . . . . . . . . . . . . . . . . . . . 60VPEAK Reverse Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -16V
Thermal Information
Thermal Resistance (Typical, Note 2) JA (oC/W) JC (oC/W) Plastic SIP Package . . . . . . . . . . . . . . 50 4 Maximum Power Dissipation, (Note 3) At TA = 125oC, Infinite Heat Sink. . . . . . . . . . . . . . . . . . . . . 6.25W Maximum Junction Temperature, TJ . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-40oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 125oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES: 1. The Input Control Voltage, VIN , may range from -0.85V to +7V for a VCC supply voltage of 0V to +25V. 2. JA is measured with the component mounted on an evaluation PC board in free air. 3. The worst case thermal resistance, JC for the SIP TS-001AA 5 pin package is 4oC/W. The calculation for dissipation and junction temperature rise due to dissipation is: PD = (VCC-VOUT)(IOUT) + (VCC)(ICCMAX - IOUT) or (VCC)(ICCMAX) - (VOUT)(IOUT) TJ = TAMBIENT + (PD) (JC) for an infinite Heat Sink. Refer to Figure 1 for Derating based on Dissipation and Thermal Resistance. Derating from 150oC is based on the reciprocal of thermal resistance, JC+HS . For example: Where JC = 4oC/W and given HS = 6o/W as the thermal resistance of an external Heat Sink, the junction-to-air thermal resistance, JA = 10oC/W. Therefore, for the maximum allowed dissipation, derate 0.1W/oC for each degree from TAMB to the maximum rated junction temperature of 150oC. If TAMB = 100oC, the maximum PD is (150 - 100) x 0.1W/oC = 5W.
Electrical Specifications
PARAMETER Operating Voltage Range Over-Voltage Shutdown Over-Temperature Limiting Negative Pulse Output Clamp Voltage Short Circuit Current Limiting Input Control ON Input Control OFF Input Current High Input Current Low Supply Current, Full Load, Input Control ON Supply Current, No Load, Input Control OFF Input-Output Forward Voltage Drop (VCC - VOUT) Output Leakage Turn-On Time Turn-OFF Time NOTE:
TA = -40C to 125C, VIN = 2V, VCC = +12V, Unless Otherwise Specified SYMBOL VCC VOVSD TSD VCL ICL = -100mA, VCC = 4.5V to 25V, VIN = 0.8V (Note 4) RL = 1k, VIN = 2V TEST CONDITIONS MIN 4.5 26 (VCC - 62) TYP 33 150 (VCC - 37) MAX 25 38 (VCC - 28) UNITS V V
oC
V
ISC VIH VIL IIH IIL ICCMAX
0.7 2.0 -
1.1 -
1.7 0.8 40 30 0.6
A V V A A A
VIN = 5.5V, VCC = 6V to 24 VIN = 0.8V, VCC = 6V to 24V VIN = 2V; IOUT = 0.55A
10 10 -
ICCMIN
VIN = 0V; IOUT = 0A
-
55
150
A
VSAT
IOUT = 0.6A, VCC = 4.5V to 25V
-
-
1.0
V
IOUT_LK tON tOFF
VIN = 0.8V, VCC = 6V to 24V RL = 80, TA = 125C RL = 80, TA = 125C
-
6 17
50 20 65
A s s
4. Short Circuit current will be reduced when Thermal Shutdown occurs. Testing of a short circuit current may require a short duration pulse.
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HIP1031 Typical Application
HIP1031 HIGH SIDE DRIVER
0.47F
POWER SUPPLY VCC 1 NEG. CLAMP ZENER RS VOUT 2
LOADS: RELAYS SOLENOIDS LAMPS MOTORS
OVERVOLTAGE SHUTDOWN
CURRENT LIMIT
THERMAL LIMIT
CONTROL CIRCUIT
TYPICAL LOAD
VIN 5 CMOS/TTL INPUT LOGIC SWITCH TO VIN 3 HIP1031 TAB VBATT VOUT 4 GND
VSAT
GND
GND VCLAMP
VCL
Typical Performance Curves
16 14 DISSIPATION WATTS (W) 12 10 8 6 4 2 0 -50 WITH EXT. 6oC/W HEAT SINK WITH EXT. 0oC/W HEAT SINK (INFINITE HEAT SINK) 0.8 FORWARD VOLTAGE DROP (V) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE (oC) AMBIENT TEMPERATURE (oC) VSAT AT IOUT = 0.5A VSAT AT IOUT = 0.25A VSAT AT IOUT = 0.75A HIP1031 VSAT WITH 20 RESISTIVE LOAD
FIGURE 1. DISSIPATION DERATING CURVES
FIGURE 2. TYPICAL VSAT CHARACTERISTIC vs TEMPERATURE
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HIP1031 Single-In-Line Plastic Packages (SIP)
OP
E A A1 Q H1
Z5.067C
(ALTERNATE VERSION) 5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE INCHES SYMBOL A MIN 0.170 0.048 0.030 0.031 0.018 0.590 0.395 MAX 0.180 0.052 0.034 0.041 0.022 0.610 0.405 MILLIMETERS MIN 4.32 1.22 0.77 0.79 0.46 14.99 10.04 MAX 4.57 1.32 0.86 1.04 0.55 15.49 10.28 NOTES 3, 4 3, 4 3, 4 3, 4 5 5 6 2 Rev. 1 4/96 NOTES: 1. These dimensions are within allowable dimensions of Rev. A of JEDEC TS-001AA outline dated 8-89. 2. Solder finish uncontrolled in this area. 3. Lead dimension (without solder). 4. Add typically 0.002 inches (0.05mm) for solder plating. 5. Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimension D. 6. Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimension D. 7. Controlling dimension: Inch.
D
A1 b b1 c
L1
b1 c
D E e e1
L
0.067 TYP 0.268 BSC 0.235 0.095 0.530 0.110 0.149 0.105 0.255 0.105 0.550 0.130 0.153 0.115
1.70 TYP 6.80 BSC 5.97 2.42 13.47 2.80 3.79 2.66 6.47 2.66 13.97 3.30 3.88 2.92
60o 12345
H1 e e1
J1
J1 L L1 OP Q
b
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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